Primarily used in the manufacturing process of semiconductor and solar cells to achieve automatic loading and unloading of silicon wafers between quartz boats and cassettes.
1.Automated loading and unloading: Automatically removes processed wafers from quartz boats and places them into cassettes, and vice versa for unprocessed wafers. This achieves fully automated material handling and reduces manual intervention.
2.High-precision positioning and gripping: Employs precise mechanical structures and control systems to ensure accurate wafer gripping and placement, preventing wafer damage. The equipment operates stably and reliably with a breakage rate ≤ 0.01%.
3.Equipment compatibility: Compatible with all mainstream equipment on the market and supports wafer sizes ranging from 18X to 230 mm, offering strong versatility and adaptability.
4.High throughput and stability: Delivers high throughput to meet mass production demands, with uptime ≥ 99%, ensuring continuous and stable operation of the production line.