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Home
About LAPLACE
Company Profile
Development History
Corporate Culture
CSR
Highlights
Products
Photovoltaic Equipment
Intelligent Manufacturing
Laser Equipment
Advanced Materials
Coatings & Adhesives
Scientific Instruments
G&D Semiconductor
Genius Way Semiconductor
News
Download
Contact Us
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Laser Equipment
Laser Equipment
Laser Edge Passivation
Precisely treats the P-N junction in the scribed area of the cell to suppress edge recombination and reduce cutting loss. This results in a module-side power gain of ≥3W.
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Laser Non-destructive Dicing Equipment
Primarily used to cut solar cells into specific dimensions and shapes.
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XBC Cell Laser Contact Opening
Key equipment used for etching and opening the passivation layer during the XBC cell manufacturing process.
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Laser Induced Metallization Equipment
Primarily used to optimize the contact between metal and semiconductors, reducing contact resistance to enhance cell conversion efficiency.
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Poly Thickness Reduction via Laser Ablation
Primarily used in solar cell manufacturing for selective thinning of the polysilicon (Poly-Si) layer on the rear side of the cell.
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