Primarily used in the fields of photovoltaics, VLSI (Very Large Scale Integration), OLED, and advanced packaging.
1.Automated loading and unloading: Automatically removes processed silicon wafers from aluminum boats and places them into cassettes, while automatically retrieving unprocessed wafers from cassettes and loading them into aluminum boats, enabling automated material handling and reducing manual intervention.
2.High-precision positioning and gripping: Utilizes precise mechanical structures and control systems, such as Bernoulli suction cups, to ensure accurate wafer gripping and placement, reducing positional deviation caused by suction and preventing wafer damage.
3.Equipment compatibility: Compatible with a wide range of mainstream equipment on the market and supports wafer sizes ranging from 18X to 230 mm, offering strong versatility and adaptability.
4.Efficient and stable operation: The equipment features a robust and stable overall structure, enabling smooth and rapid loading and unloading. This not only ensures more stable wafer transfer but also enhances wafer transfer efficiency, allowing for long-term stable operation and ensuring production line continuity.
5.Modular design: Adopts a modular design, allowing integration with mainstream market equipment and customization based on customer requirements to meet the production needs of various enterprises.
