Texturing Load-and-Unload Automation

Texturing Load-and-Unload Automation

Texturing Load-and-Unload Automation

Description

The texturing load-and-unload automation is applied for the transfer of silicon wafers before and after the texturing process in solar cell manufacturing.

1.Automated loading and unloading: After raw materials are loaded into designated positions, the texturing load-and-unload automation can automatically dock with AGV trolleys, receive silicon wafers delivered by the AGV, retrieve the wafers from cassettes, and convey them to the texturing machine for processing. Upon completion of the process, the textured wafers are removed from the texturing machine, placed into cassettes, and then transported by the AGV trolley.
2.High-precision positioning and handling: Driven by servo motors and other drive mechanisms, the equipment achieves high-speed, gentle motion actions, enabling high-precision positioning and handling of silicon wafers. This ensures accuracy and stability during the loading and unloading process, thereby reducing wafer breakage.
3.Wafer inspection and rejection: Equipped with detection functions for silicon wafers, microcracks, and fragments, the equipment can automatically reject wafers that do not meet quality requirements, ensuring the quality of wafers entering the texturing process.
4.High throughput and stability: Optimized with measures such as a four-channel design, the equipment achieves a throughput of over 17,000 pcs/h (full cell) or 32,000 pcs/h (half-cut). The equipment boasts high uptime (≥ 99%), ensuring continuous and stable operation of the production line.
5.Size and cassette compatibility: Compatible with various wafer sizes (square, pseudo-square, rectangular, etc.) and various specifications of flower baskets.

Parameter
  • Product DimensionsSubject to the final drawings confirmed after discussions
  • ThroughputNet throughput per equipment ≥ 18000 pcs/h
  • Uptime≥99%
  • BreakageFull cell breakage ≤ 0.02%
  • Wafer traceabilityAccuracy>Accuracy > 99.9%
  • Wafer Size18X-230mm
  • Optional1. Microcrack detection 2. Wafer overlap detection 3. Incoming breakage optical detection (Vision) 4. Wet wafer detection (AOI)
Highlights
  • High stability with Bernoulli picker system for efficient operation
  • High tolerance with warped cells, suitable for BC solar cells
  • Stand-alone smart system monitors output and OEE
  • Compatible with AGV, RFID; Optional MES function