The FK Quick-Dry Adhesive features high-temperature resistance, rapid drying, water resistance, and ease of application. It is suitable for ceramic bonding and bonding between dissimilar materials such as metal and ceramic. It does not release powder or gases at high temperatures and does not affect the vacuum level of process chambers.
Photovoltaics, Semiconductors, High-Temperature Industries, Electronics & Electrical Equipment, and related industries.
Suitable for bonding, sealing, and repair of metal components; potting and bonding of insulating components in high-temperature sensors, thermocouples, ignition devices, and electric heating equipment; and bonding between ceramic components and metals.