Laser Non-destructive Dicing Equipment

Laser Non-destructive Dicing Equipment

Laser Non-destructive Dicing Equipment

Datasheet
Description

Laser non-destructive dicing adapts the concept of precisely controlled heating in pair with localized cooling technique to create a temperature gradient, which will create thermal stress in the substrate, and the substrate will break once it reaches its fracture threshold. The crack propagates along the thermal gradient induced by the laser beam path, leading to complete clean separation of the substrate.

Laser Solution:
● Laser configuration: 50 W infrared pulsed + 300 W infrared continuous (30% power reserved)
● High beam quality laser and matching laser output device for excellent cutting results
● Customized water atomization unit to ensure cleaving stability

Dicing Solution:
● Thermal crack spot fine curing to optimize cutting performance (reduces cleaving temperature, improves straightness)
● Co-axial spot technology: Aligns the grooving and thermal crack spots precisely, minimizing various defects and imperfections caused by misalignment, thereby enhancing the final module performance.

Parameter
  • Product Dimensions L7060 mm × W4580 mm × H2950 mm
  • Function Full wafer to half-cut / multi-cut
  • Wafer Size 18X – 230 mm; thickness 100 – 220 µm
  • Throughput Inline ≥ 12000 pcs/h; Offline ≥ 14000 pcs/h
  • Breakage ≤ 0.04% @18X, ≤ 0.05% @210
  • Uptime ≥ 98.5%
  • Laser Power Grooving ≥ 50 W; Cleaving ≥ 300 W
  • Laser Performance Power stability ≤ 2% RMS, annual degradation < 3%
  • Dicing Precision ± 0.1 mm
  • Defect Inspection ≥ 0.5 mm × 0.5 mm
  • Water Consumption < 1 L per 10,000 wafers
Highlights
  • High Throughput：
    ● Standard dual-lane throughput 12,000 pcs/h
    ● Dual laser station cutting per single lane
  • Compact Structure：
    ● Small footprint
    ● Easy maintenance of core components
  • High Compatibility：
    ● Upgradable to third-cut dicing
    ● Compatible with various cell formats 18X – 230 mm, no accessory change required
  • High Dicing Precision：
    ● Strictly controlled grooving length ≤ 1.3 mm
    ● Elliptical spot cutting straightness ±0.05 mm
    ● Minimized cutting damage
  • Strong Stability：
    ● Wide process window, stable cleaving, laser maintenance interval ≥ 30 days, laser service life > 20,000 hours