Low Pressure Oxidation / Annealing

Low Pressure Oxidation / Annealing

Low Pressure Oxidation / Annealing

Description

Low pressure horizontal oxidation /annealing system suitable for thermal annealing and thermal activation processes of various solar cell structures, such as PERC, PERT, TOPCon and TBC cells.

1. Low pressure oxidation and annealing processes: Under a low pressure atmosphere, the equipment forms an oxide layer on the silicon wafer surface through methods such as thermal decomposition, and can also perform annealing treatments to improve the wafer’s crystal structure, enhance its performance and stability, and contribute to the overall quality and efficiency improvement of solar cells.
2. Precise temperature control: Featuring the temperature range of 600 – 1050°C, it is configured with an innovative 4 segment thermal field and the ATS system, enabling more precise temperature control. This provides a stable temperature environment for oxidation and annealing processes, ensuring process consistency and repeatability.
3. Compatibility with multiple wafer sizes: The equipment is compatible with various wafer sizes ranging from 18X to 230 mm, meeting the production requirements of different solar cell specifications with high versatility and adaptability.
4. High throughput and low cost: Adopting a high-capacity double loading design, the single tube wafer capacity can reach 2400 – 3120 pcs/tube, effectively reducing unit production costs and improving production efficiency.
5. Automated and intelligent control: Equipped with a fully automated intelligent control system featuring a one-click temperature auto tuning function, which reduces commissioning time. It is easily integrated into MES or production control systems, enabling automated monitoring and management of the production process with convenient operation and simple maintenance.
6. Excellent sealing and efficient cooling: A new type of flange fixation method enhances the sealing performance of the equipment, ensuring the stability of the low pressure process environment. Additionally, the equipment is equipped with a new water-cooled furnace door system and a new cooling purification area, enabling rapid cooling and improving both production efficiency and equipment lifespan.

Parameter
  • Product DimensionsL10820mm*W2400mm*H4600mm
  • Uptime98%
  • Tube I.D 430-450mm
  • Capacity2400 – 3120 pcs/tube
  • Wafer Size Compatible with 18X – 230 mm
  • Temperature600-1050℃
  • OptionalWater oxygen process configurable
Highlights
  • High capacity with double loading
  • New type of flange fixation for improved sealing
  • New water-cooled furnace door system
  • New cooling purification area
  • Fully automatic intelligent control system
  • One-click temperature auto tuning function reduces commissioning time
  • Innovative 4 segment heater + ATS system for better temperature control