Primarily used for automated wafer transfer and loading/unloading operations.
1.Compatibility with multiple wafer specifications: Compatible with wafer sizes of 18X – 230 mm and applicable wafer thickness ranging from 150 – 220 µm, meeting the production requirements for wafers of different dimensions.
2.Automated loading, unloading and transfer: Once wafers are placed into stacking cassettes, the equipment can automatically transfer wafers from the stacking cassette into wet process cassettes, or remove wafers from the wet cassette and place them into the stacking cassette, enabling automated material handling. Additionally, the equipment is equipped with a reserved AGV interface, allowing it to coordinate with AGV trolleys for automated wafer transfer between different equipment units.
3.High-precision positioning and low breakage rate: Through precise mechanical structures and control systems, the equipment ensures accurate wafer gripping and placement with stable and reliable operation. The breakage rate is ≤ 0.03%, effectively protecting wafers from damage.
4.High throughput and high uptime: High throughput, single unit (net capacity) ≥ 16000 pcs/h; uptime ≥ 99%, capable of meeting large-scale production demands.
5.Online automation and communication linkage: The equipment features online automatic mode with port and host communication linkage. It can automatically control material feeding based on host instructions, realizing fully automated operations including infeed, outfeed, and cassette transfer.
6.Compatibility with full and half-cut wafers: Enhances the equipment’s versatility and production efficiency.