Provides fully automated, high-precision silicon wafer handling and loading/unloading for PECVD equipment, connecting upstream and downstream processes to achieve continuous production.
1.Fully automated material transfer: Without manual intervention, completes the retrieval, placement, and conveyance of substrates between cassettes and the equipment reaction chamber, including loading (feeding substrates into the equipment) and unloading (removing substrates from the equipment).
2.High-precision positioning and gripping: Utilizes robotic arms, suction cups, or grippers combined with vision align ment to ensure stable substrate handling, with positioning accuracy reaching the micrometer level during convey ance, preventing scratches and breakage.
3.Process integration and compatibility: Adapts to various wafer sizes, can be linked with multiple PE equipment units to achieve continuous multi-step production, and is compatible with different cassette specifications.
4.Safety and status monitoring: Equipped with anti-collision and anti-drop sensors to monitor material status and equipment operation in real time. Automatic shutdown and alarm activation occur in the event of abnormalities, ensuring production safety.
5.Throughput and efficiency enhancement: Replaces manual loading and unloading, reduces waiting time, features a short single-cycle loading/unloading time, supports 24-hour continuous operation, and significantly improves overall production line throughput.