The core function of the LPCVD equipment is to uniformly deposit thin films onto substrate surfaces through the decomposition or reaction of vapor-phase reactants under low-pressure and medium-to-low temperature environments.It is capable of preparing silicon oxide and various crystalline silicon films, which are utilized in high-efficiency N-type TOPCon and BC solar cells, with potential extensibility to thin film deposition in the semiconductor device sector.
1. Core role of film deposition: Forms solid thin films on substrate surfaces such as silicon wafers and ceramics. Film types include polysilicon, silicon dioxide, silicon nitride, and others used in semiconductor applications.
2. Process environment control: Precisely regulates pressure, temperature, and gas flow within the reaction chamber, providing stable conditions for film growth.
3. Film quality assurance: Excellent film uniformity control and precise thickness regulation, while minimizing impurity residues and enhancing film density.
