Silicon Carbide Adhesive

Silicon Carbide Adhesive

Silicon Carbide Adhesive

Specifications
  • ColorGray White
  • Long-Term Service Temperature1150℃
  • Viscosity35℃ 7700cps
  • Bond Strength>19MPa
  • Density2.1-2.4g/cm³
  • Shrinkage<1%
  • Coefficient of Thermal Expansion4.20 × 10⁻⁶ K⁻¹
  • Thermal Conductivity1.049W/m.K
Product Description

The Silicon Carbide Adhesive is formulated as a fully inorganic system and contains no volatile organic compounds (VOCs). It produces no smoke or unpleasant odors at high temperatures, providing a clean and environmentally friendly solution. It maintains high bond strength at temperatures up to 1150°C, with a coefficient of thermal expansion closely matched to that of silicon carbide and ceramic substrates, offering excellent thermal shock resistance. After curing, it forms a dense ceramic coating with excellent wear resistance, acid and alkali corrosion resistance, and oxidation resistance. It can also be used as both a repair material and a protective coating.

Applicable Industries

Photovoltaics, Semiconductors, Aerospace & Defense, High-Temperature Industrial Furnaces, and related industries.

Use Cases

Suitable for bonding and crack repair of components such as silicon carbide furnace tubes, cantilever paddles, and boats in semiconductor equipment; bonding and repair of heat-resistant structural components; crack repair and grouting of ceramic linings in blast furnaces, hot-blast furnaces, rotary kilns, and shuttle kilns; and potting of burners and protective tubes for thermocouples.